How Chips Are Using Chiplets to Beat Moore Law Limits

Failed to add items

Sorry, we are unable to add the item because your shopping cart is already at capacity.

Add to basket failed.

Please try again later

Add to wishlist failed.

Please try again later

Remove from wishlist failed.

Please try again later

Adding to library failed

Please try again

Follow podcast failed

Unfollow podcast failed

How Chips Are Using Chiplets to Beat Moore Law Limits

Listen for free

View show details

Episode 75 of The Hardware Podcast with Fexingo. Lucas and Luna dive into the chiplet revolution—why the industry is moving from monolithic chips to modular, multi-die packages. They break down AMD's successful chiplet strategy with EPYC and Ryzen processors, compare it with Intel's delayed Ponte Vecchio GPU, and explore the technical challenges of die-to-die interconnects like Universal Chiplet Interconnect Express (UCIe). The hosts also touch on how chiplet architectures allow designers to mix process nodes, reducing cost and improving yields. Along the way, they acknowledge listener support as the reason the show stays ad-free, with a link to buy me a coffee dot com slash fexingo. Perfect for hardware engineers, semiconductor enthusiasts, and anyone curious about the future of chip design. #Chiplets #AMD #Intel #UCIe #Semiconductors #MooreLaw #ChipDesign #DieToDie #AdvancedPackaging #EPYC #Ryzen #PonteVecchio #ProcessNodes #Technology #HardwarePodcast #FexingoBusiness #BusinessPodcast #Podcast Keep every episode free: buymeacoffee.com/fexingo

No reviews yet