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The Hardware Podcast with Fexingo: Chips, Devices, and Electronics Engineering Conversations

The Hardware Podcast with Fexingo: Chips, Devices, and Electronics Engineering Conversations

By: Fexingo
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Lucas and Luna sit down at a lab bench cluttered with oscilloscopes and prototype boards to talk about the engineering decisions that shape the chips powering modern life. Each episode takes one piece of hardware — a new RISC-V core, a GaN power amplifier, a MEMS accelerometer — and examines its design trade-offs, yield challenges, and market positioning. They discuss why Intel’s 20A node matters for foundry customers, how TSMC’s CoWoS packaging affects AI accelerator supply, and what the CHIPS Act subsidies mean for domestic fab construction. Lucas brings the component-level knowledge (threshold voltages, die sizes, lithography steps); Luna pushes on the system-level implications (thermal constraints, software compatibility, supply chain risk). The listener is someone who reads datasheets for fun, follows EDA tool announcements, or needs to decide between an FPGA and an ASIC for their next product. No hot takes on Apple’s latest chip — just a careful look at what the die shot reveals and whether the architecture will trickle down to mid-range devices. Can a country really onshore advanced semiconductor manufacturing in a decade? How do you test a chip with billions of transistors? And what does the shift to chiplets mean for the engineer designing a PCB today? #SemiconductorIndustry #ChipDesign #HardwareEngineering #Electronics #TSMC #Intel #RISCV #GaN #MEMS #EDA #ASIC #FPGA #CHIPSAct #DieShot #EngineeringConversations #Technology #FexingoBusiness #BusinessPodcast Keep every episode free: buymeacoffee.com/fexingo© 2026 Fexingo. All rights reserved. Economics
Episodes
  • Why Chips Are Moving Data With Light Not Wires

    Why Chips Are Moving Data With Light Not Wires
    Jun 29 2026
    Episode 80 dives into on-chip optical interconnects—how silicon photonics is replacing copper wires with laser light to move data faster and cooler. Lucas and Luna unpack Intel's integrated laser breakthrough, the power savings at 50 gigabits per second, and why this matters for AI data centers by mid-2026. A concrete look at one fab's photonic roadmap and the engineering trade-offs between heat, bandwidth, and cost. #SiliconPhotonics #OpticalInterconnects #Intel #AIHardware #DataCenter #CopperWires #LaserLight #Bandwidth #PowerEfficiency #ChipDesign #Semiconductor #Photonics #Technology #FexingoBusiness #BusinessPodcast #HardwarePodcast #Engineering #Innovation Keep every episode free: buymeacoffee.com/fexingo
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    10 mins
  • Why Chips Are Using On-Chip Capacitors to Stabilize Power

    Why Chips Are Using On-Chip Capacitors to Stabilize Power
    Jun 28 2026
    In this episode of The Hardware Podcast, Lucas and Luna dive into the emerging trend of deep trench capacitors (DTCs) integrated directly into silicon chips. They explore how companies like Intel and TSMC are embedding these passive components to combat voltage droop, reduce noise, and improve power delivery in high-performance processors. With specific numbers on capacitance density and performance gains, they explain why this technology is becoming essential for AI accelerators and data center CPUs. The conversation also touches on the manufacturing challenges and cost trade-offs, making the case that on-chip capacitors are a quiet but crucial innovation in chip design. #DeepTrenchCapacitors #OnChipCapacitors #PowerDelivery #VoltageDroop #ChipDesign #Intel #TSMC #AIAccelerators #Semiconductor #ProcessorDesign #HardwareEngineering #Technology #Chips #Electronics #FexingoBusiness #BusinessPodcast #TheHardwarePodcast #Podcast Keep every episode free: buymeacoffee.com/fexingo
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    10 mins
  • Why Chips Are Using On-Chip Antennas for Wireless Interconnects

    Why Chips Are Using On-Chip Antennas for Wireless Interconnects
    Jun 28 2026
    In this episode of The Hardware Podcast, Lucas and Luna explore the emerging trend of integrating antennas directly onto silicon chips to replace traditional wired interconnects for short-range data communication. They discuss a 2025 paper from Intel Labs demonstrating a 60GHz on-chip antenna array achieving 40 Gbps data rates over a few millimeters, the engineering challenges of antenna efficiency in silicon, and how this technology could reshape chip-to-chip communication in data centers and multi-chip modules. The conversation also covers comparisons with existing solutions like TSV and optical interconnects, and the potential for wireless interconnects to reduce latency and power consumption in dense compute clusters. Tune in for a detailed look at a cutting-edge hardware innovation that may soon become standard in high-performance computing. #OnChipAntennas #WirelessInterconnects #ChipDesign #IntelLabs #60GHz #SiliconPhotonics #DataCenter #Chiplet #HighPerformanceComputing #InterconnectTechnology #Technology #HardwareEngineering #FexingoBusiness #BusinessPodcast #Semiconductors #WirelessCommunication #MMWave #AntennaDesign Keep every episode free: buymeacoffee.com/fexingo
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    8 mins
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