Why Chipmakers Are Building Silicon Photonics Foundries

Failed to add items

Sorry, we are unable to add the item because your shopping cart is already at capacity.

Add to basket failed.

Please try again later

Add to wishlist failed.

Please try again later

Remove from wishlist failed.

Please try again later

Adding to library failed

Please try again

Follow podcast failed

Unfollow podcast failed

Why Chipmakers Are Building Silicon Photonics Foundries

Listen for free

View show details

This episode explores the shift from research-lab silicon photonics to commercial foundry production. Lucas and Luna discuss how TSMC, Intel, and GlobalFoundries are integrating optical components alongside traditional CMOS, the role of the 300-millimeter wafer platform, and what this means for datacenter interconnect bandwidth. The conversation focuses on the practical engineering challenges—waveguide loss, laser integration, and thermal stability—and why the industry believes now is the moment to scale. Specific examples include the co-packaged optics roadmap at 800G and 1.6T Ethernet, and the emergence of multi-die optical interposers. No hype, just the physics and economics driving this manufacturing transition. #SiliconPhotonics #ChipManufacturing #TSMC #Intel #GlobalFoundries #OpticalInterconnects #Datacenter #CoPackagedOptics #PhotonicsFoundry #300mmWafer #CMOS #Waveguide #LaserIntegration #Technology #Hardware #FexingoBusiness #BusinessPodcast #Semiconductors Keep every episode free: buymeacoffee.com/fexingo

No reviews yet